Read the full sentence. It includes the fact that the die stacking is also an in... | Hacker News

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		IanCutress on July 2, 2020 \| parent \| context \| favorite \| on: Intel Lakefield deep dive: the first x86 hybrid CP... Read the full sentence. It includes the fact that the die stacking is also an innovation, and using them together is an innovation.

sitkack on July 3, 2020 [–]

Those are mechanisms that enable innovation, in and of themselves, they are a curiosity. This moves the needle zero when it comes to competing with AMD.

I believe Intel could do it, but they would have to figure out what they really want.

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