There are other concerns wrt contamination though, e.g. masks degrading in the EUV radiation and emitting contaminants that end up on the wafer. This is more likely to happen at higher power levels.
These and other concerns are discussed at Chris Mack's website http://life.lithoguru.com/ (he is quoted in the linked article). His series of posts on the SPIE Advanced Lithography Symposium 2016 is particularly interesting and seems to be the basis of most of the more-popular press articles on EUV in the last week.
Very interesting link. I at first wondered how such a thin film would be strong enough, then realized they intend to have both sides of the window in vacuum so there is no pressure differential, and no need for strength. (Which should have been obvious since air is opaque.)
There are other concerns wrt contamination though, e.g. masks degrading in the EUV radiation and emitting contaminants that end up on the wafer. This is more likely to happen at higher power levels.
These and other concerns are discussed at Chris Mack's website http://life.lithoguru.com/ (he is quoted in the linked article). His series of posts on the SPIE Advanced Lithography Symposium 2016 is particularly interesting and seems to be the basis of most of the more-popular press articles on EUV in the last week.